Image sensor pixels having built-in variable gain feedback amplifier circuitry

ABSTRACT

An image sensor may include an array of image sensor pixels. Each pixel may have a photodiode, a floating diffusion node, and charge transfer gate. An amplifying transistor may have a gate terminal coupled to the floating diffusion and a drain terminal coupled to an output node. The amplifying transistor may provide signal corresponding to transferred charge with a greater than unity voltage gain. A negative voltage feedback capacitor having variable capacitance may be coupled between the output node and the floating diffusion node thereby increasing the pixel dynamic range. A reset transistor may be coupled between the floating diffusion and output node. The amplifying transistor may include a p-channel transistor formed within a mini n-well region of the pixel or an n-channel transistor formed within a mini p-well region. The pixel may have increased storage capacity and dynamic range relative to conventional designs.

BACKGROUND

This relates to solid-state image sensor arrays (e.g., complementarymetal-oxide-semiconductor (CMOS) arrays) and, more specifically, toimage sensors with pixels having built-in voltage feedback amplifiercircuitry. The pixels can have submicron sizes and can be illuminatedfrom the back side or the front side of a pixel substrate on which thepixels are formed.

Typical image sensors sense light by converting impinging photons intoelectrons (or holes) that are integrated (collected) in sensor pixels.Upon completion of each integration cycle, the collected charge isconverted into voltage signals, which are supplied to correspondingoutput terminals associated with the image sensor. Typically, thecharge-to-voltage conversion is performed directly within the pixels,and the resulting analog pixel voltage signals are transferred to theoutput terminals through various pixel addressing and scanning schemes.The analog voltage signal can sometimes be converted on-chip to adigital equivalent before being conveyed off-chip. Each pixel includes abuffer amplifier (i.e., source follower) that drives output sensing,lines that are connected to the pixels via respective addresstransistors.

However, such arrangements involve below unity gain amplifier (i.e., again less than 1 in which the output has a lesser magnitude than theinput) within the pixel. This makes the signal lines connected to thepixels susceptible to various noise and interference pickups, which isone of several disadvantages of the existing technology. After thecharge-to-voltage conversion is completed and after the resultingsignals are transferred out from the pixels, the pixels are reset beforea subsequent integration cycle begins. In pixels that include floatingdiffusions (FD) serving as the charge detection node, this resetoperation is accomplished by momentarily turning on a reset transistorthat connects the floating diffusion node to a voltage reference(typically the pixel current drain node) for draining (or removing) anycharge transferred onto the FD node. However, removing charge from thefloating diffusion node using the reset transistor generates thermalkTC-reset noise, as is well known in the art. This kTC reset noise mustbe removed using correlated double sampling (CDS) signal processingtechniques in order to achieve desired low noise performance. TypicalCMOS image sensors that utilize CDS require at least four transistors(4T) per pixel. An example of the 4T pixel circuit with a pinnedphotodiode can be found in Lee (U.S. Pat. No. 5,625,210), incorporatedherein as a reference.

FIG. 1 shows a simplified circuit diagram of a pixel 100 in a CMOSsensor. Pixel circuit 100 has a two-way shared photodiode scheme inwhich two photodiodes share a single floating diffusion node. Inparticular, photodiodes 101 (PD1) and 102 (PD2) share common floatingdiffusion (FD) charge detection node 114 to which source follower (SF)transistor 103 is connected. The drain terminal of source followertransistor 103 is connected to Vdd column bias line 109 and the sourceterminal of source follower transistor 103 is connected to column outputsignal (readout) line 108 through addressing transistor 104. Chargedetection node 114 is reset by reset transistor 105, which is alsoconnected to Vdd column bias line 109. Charge from photodiodes 101 and102 is transferred onto floating diffusion node 114 by charge transfertransistors 106 and 107, respectively. Reset transistor gate 105 iscontrolled by reset control signals received over row control line 110,charge transfer transistor gates 106 and 107 are controlled by transfercontrol signals received over row lines 112 and 113, respectively, andaddressing transistor gate 104 is controlled by row select controlsignals received over row addressing line 111. As shown in FIG. 1, it isclear that each pair of pixel photodiodes must be coupled to a total offive transistors (i.e., 2.5 transistors per photodiode). Conventionalarrangements such as the arrangement of FIG. 1 involve below unity gainamplification generated by the buffer amplifier of source follower 103,causing signal line 108 to be susceptible to noise and interferencepickups, which can distort the final image signal produced by the pixel.

It would therefore be desirable to be able to provide improved imagesensor pixels.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified circuit diagram of a conventional image sensorpixel having two photodiodes sharing the same pixel circuitry, whichincludes two transfer gates, a source follower transistor, an addressingtransistor, and a reset transistor.

FIG. 2 is an illustrative circuit diagram of an image sensor pixelhaving two photodiodes that share a common floating diffusion regionhaving a p-channel gain transistor, a p-channel addressing transistor,an n-channel reset transistor, a pre-charge capacitor, and a variablefeedback capacitor for improving the noise susceptibility of the imagesensor pixel in accordance with an embodiment of the present invention.

FIG. 3 is an illustrative timing diagram of a readout sequence performedby a selected row of image sensor pixels having the circuit of the typeshown in FIG. 2 in accordance with an embodiment of the presentinvention.

FIG. 4 is an illustrative diagram of a pixel circuit and a correspondingpartial pixel cross section showing how gain and addressing transistorsof the type shown in FIG. 2 may be placed within a mini n-well region ofthe pixel substrate in accordance with an embodiment of the presentinvention.

FIG. 5 is an illustrative diagram of a pixel circuit and a correspondingpartial pixel cross section of an image sensor pixel of the type shownin FIG. 2 further illustrating how p-type doped drain extension portionsof a gain transistor may form a variable capacitance for controllingamplifier gain depending on the number of detected electrons inaccordance with an embodiment of the present invention.

FIG. 6 is an illustrative diagram of the potential profile under thegate of a p-channel gain transistor of the type shown in FIGS. 2-5 thatillustrates how holes may flow depending on a position of the drainQuasi Fermi level in accordance with an embodiment of the presentinvention.

FIG. 7 is an illustrative graph showing the dependence of pixel outputvoltage of a pixel of the type shown in FIG. 2 on the number of inputelectrons received from the corresponding photodiode where a break pointin the graph may depend on a doping level of a p-type doped drainextension of the type shown in FIG. 5 in accordance with an embodimentof the present invention.

FIG. 8 is an illustrative diagram showing the bias potentials and energyband diagrams in a fully depleted mini n-well region under the drain ofa p-channel MOSFET transistor of the type shown in FIGS. 2-7 inaccordance with an embodiment of the present invention.

FIG. 9 is an illustrative layout diagram of a four photodiode per sharedfloating diffusion region pixel topology, in which the p-channel MOSFETgain transistor and the p-Channel MOSFET addressing transistor arelocated in an STI region between photodiode rows in accordance with anembodiment of the present invention.

FIG. 10 is a block diagram of a processor system employing the imagesensor pixels of FIGS. 2-9 in accordance with an embodiment of thepresent invention.

DETAILED DESCRIPTION

A simplified circuit diagram of an illustrative image sensor pixelhaving built-in amplifier circuitry with adjustable gain is shown inFIG. 2. As shown in FIG. 2, pixel circuit 200 may include a firstphotodiode 219 (PD1) and a second photodiode 218 (PD2) that share thesame pixel circuitry 200. This example is merely illustrative and, ifdesired, pixel 200 may include four or more photodiodes that share acommon charge detection circuit. Charge transfer transistor 220 mayconnect second photodiode 218 to common (shared) floating diffusion node201 (sometimes referred to herein as a charge storage node, chargedetection node, charge storage region, floating diffusion region, orfloating diffusion junction region). Charge transfer transistor 221 mayconnect first photodiode 219 to floating diffusion node 201. The gatesof transfer transistors 220 and 221 may receive transfer control signalsfrom row control circuitry (not shown for the sake of simplicity) overrow control lines 214 and 215, respectively.

Charge detection node 201 may be connected to pre-charge capacitor 216(having capacitance Cp). Capacitor 216 may be coupled between node 201and row control line 212 for receiving a controlling signal. Feedbackcapacitor 207 (having variable capacitance Cf), the gate terminal ofp-channel metal-oxide-semiconductor field-effect transistor (MOSFET) 202(sometimes referred to herein as gain transistor 202, amplifyingtransistor 202, or amplifier transistor 202), and the source terminal ofn-channel MOSFET reset transistor 206 may be coupled to charge storagenode 201. Floating diffusion node 201 may have an equivalent capacitanceCn as indicated by capacitor 217. The drain terminal of p-channel MOSFETtransistor 202, the drain terminal of n-channel MOSFET reset transistor206, feedback capacitor 207, and p-channel MOSFET addressing transistor205 may be coupled to circuit output node 204 (sometimes referred to aspixel output node 204). Addressing transistor 205 may connect outputnode 204 to column sense line 208, which is common to all the pixels inthat column of the corresponding pixel array and delivers the selectedpixel output signal to the periphery of the array.

The source terminal of p-channel MOSFET transistor 202 may be coupled tocolumn line 203 over which bias voltage Vdd is provided to allcorresponding the transistors in that column of the array. Resettransistor 206 may receive reset control signals from row controlcircuitry over row control line 209 and addressing transistor 205 mayreceive row select (addressing) control signals from the row controlcircuitry over row control line 210. The capacitance of signal outputcolumn line 208 is indicated by column capacitor 211 (e.g., havingcapacitance Cc). Column output line 208 may be coupled to constantcurrent source 212. Current source 212 may provide current bias to theselected pixels 200. The connections of the pixel array to the peripheryor to the underlying chip that carries the rest of the image processingcircuits are indicated by via connections 222.

The operation of pixel circuit 200 can be understood from the simplifiedtiming diagram 300 shown in FIG. 3. For the sake of simplicity, thisdiagram shows only the signal readout from one of the shared photodiodes(e.g., photodiode 219 of FIG. 2) in a given selected row of the array.As shown in FIG. 3, pixel readout operations begin by turning onp-channel MOSFET row select transistor 205 for the pixels of theselected row of the pixel array. This may be accomplished by applyingwaveform 301 to the gate of addressing transistor 205 at the time t1.This may be followed by applying a partial step signal 305 to the gateof charge transfer transistor 221 at the time t2, which, however, doesnot start the charge transfer from the photodiode to the chargedetection node 201. This step lowers the voltage swing on transfer gate221 that lowers the feed through from this gate to the floatingdiffusion node 201. This operation is beneficial for the circuitoperation, as the transfer gate is typically biased by a considerablenegative bias to accumulate holes under the gate and thus to minimizethe generation of dark current from the silicon-silicon dioxideinterface states in the region under this gate. The partial step signal305 eliminates this bias and prepares the gate for the charge transferat a later time.

In the next step, the pixel reset may be released by applying signal 302at time t3 to the gate of reset transistor 206. This step may befollowed by applying pre-charge pulse 303 at lime t4 to charge detectionnode 201 through pre-charge capacitor 216. This step is importantbecause it lowers the pixel output to its minimum level and thusprovides the necessary output voltage swing margin for the signal. Thepixel output signal Vout may be sampled after the elapse of a certainsettling time given by a correlated double sampling (CDS) referencepulse R at time t5, as is indicated by waveform 304. This step may befollowed by charge transfer from the selected pixel photodiode 219 atthe time to by applying the full charge transfer pulse (waveform 305).This causes the pixel output to swing higher, thus partiallycompensating for the previously introduced pre-charge signal to thefloating diffusion node 201. It is thus clear that the level of thepre-charge should be commensurate with the level of the expected chargesignal from the photodiode. It is also clear that the voltage swing onfloating diffusion node 201 is minimal due to the action of negativefeedback through feedback capacitor 207 from the pixel output 204. Thelow voltage swing on floating diffusion node 201 is another advantage ofthis in-pixel amplifier concept, which allows design and operation ofthe pinned photodiode with a higher pinning voltage and thus an increasein its charge storage capacity relative to conventional pixels.

The pixel output level may be sampled again after the elapse of acertain settling time by the CDS circuits at the time t7 by the pulse Sas is indicated by waveform 306. The readout sequence may be completedby turning on reset transistor 206 at time t8 (waveform 302), biasingoff transfer gate 221 to its pinning level at time t9 (waveform 305),and finally turning off the pre-charge pulse and the pixel addressingtransistor at time t10 (waveforms 301 and 303).

In conventional image sensor pixels (such as the type shown in FIG. 1),the source follower transistors are n-channel type transistors. In thepresent invention as illustrated in FIG. 3 in which an in-pixelamplifier circuit is formed (e.g., an amplifier circuit built into thepixel), the transistor that amplifies the signal detected on floatingdiffusion node 201 is a p-channel MOSFET transistor preferably with ap-type doped poly-silicon gate e.g., as opposed to the n-channel sourcefollower transistor of FIG. 1). For this reason, it may be necessary toform a miniature n-type well region 405 as shown in FIG. 4. The minin-type well 405 may be a lightly n-type doped region in the pixelsubstrate and may sometimes be referred to herein as a mini n-well,miniature n-well, or simply as the n-well of the pixel. The pixelsubstrate may be a p-type doped epitaxial layer 403. P-channel MOSFETtransistor 202 may be formed within this mini n-well region 405.

FIG. 4 shows a simplified device cross section 400 and circuit schematicdiagram of a pixel having built-in amplifier circuitry such as pixelcircuit 200 of FIG. 2. In particular, the example of FIG. 4 shows asimplified schematic of the charge transfer transistor 413(corresponding to transistor 221 of FIG. 2, for example), photodiode 412(e.g., corresponding to photodiode 219), reset transistor 414(corresponding to reset transistor 206), and pre-charge capacitor 416(corresponding to capacitor 216), and a simplified device cross sectionof corresponding built-in (intra-pixel) amplifier transistor gate 410(corresponding to transistor 202) and the corresponding addressingtransistor gate 411 (corresponding to transistor 205).

As shown in FIG. 4, transistor gates 410 and 411 are both placed withinmini n-well region 405. Transistor gates 410 and 411 are typicallyisolated from the epitaxial substrate 403 by a silicon dioxide layer orother suitable insulators such as a combination of oxide and nitridelayers. The floating diffusion charge detection node 201 of FIG. 2 isshown as node 425, which may also have a feedback capacitor (e.g.,capacitor 207) connected to it (not shown for the sake of simplicity).The amplifying p-channel MOSFET transistor 410 may have a correspondingsource terminal 407 connected to Vdd column bias line 426 (correspondingto line 203 of FIG. 2). Line 426 may be connected to n+ doped region 406that provides the bias voltage to mini n-well 405. Mini n-well 405 maybe partially or fully depleted of electron mobile charge. P-channelMOSFET transistor 410 may have a drain terminal shown by region 408 thatis common (shared) with the drain of the addressing transistor (gate411). Region 409 may be the source terminal of addressing transistor 411and may be connected to common signal column line 423 (corresponding toline 208) that supplies the signal to the array periphery or through via424 to the carrier chip in the case that a chip stacking technology isused. The transistor controlling signals may be supplied to the pixelsthrough row lines 417, 418, 419 and 420, respectively. The amplifiercircuit may be biased by current source 421 (corresponding to currentsource 212) that is located at the sensor array periphery or on thecarrier chip. The column sense line may have a capacitance Cb asindicated by capacitor 422 (corresponding to capacitor 211) that mayalso include via capacitance.

A p+ type retrograde doped p-well (RPW) layer 404 may be placed underthe partially or fully depleted mini n-well 405 to prevent lightgenerated electrons in the bulk of the epitaxial layer 403 from enteringinto mini n-well 405. These electrons are thus diverted to flow into thephotodiode 412, which is shown in the drawing only schematically for thesake of simplicity. In scenarios where the image sensor pixel isilluminated from the back side of the substrate (e.g., from the bottomof FIG. 4), the silicon substrate 401 may include a p+ type doped layer402 deposited at the back side surface to minimize interface statesgenerated dark current.

This example is merely illustrative. In another suitable arrangement,addressing transistor 411 may be an n-channel type transistor. Inscenarios where holes are collected in the photodiodes instead ofelectrons, the doping of all the layers and the junctions may beinverted as well as the corresponding bias voltages. This results in theepitaxial layer being n-type doped, the RPW layer being changed to anRNW layer and retrograde doped by the n+ type doping, the mini n-wellchanged to a mini p-well, and all the remaining junctions changed toopposite polarities, for example.

Another suitable arrangement for the pixel having built-in amplifiercircuitry is shown in FIG. 5. As shown in FIG. 5, drawing 500 may besimilar to drawing 400 in FIG. 4 with all the elements starting with thenumber 501 and ending with the number 525 corresponding to the elementsstarting with the number 401 and ending with the number 425 of FIG. 4(e.g., element 525 corresponds to element 425, element 414 correspondsto element 514, etc.). The difference between the arrangement of FIG. 5and the arrangement of FIG. 4 is in the structure of the p-channelMOSFET gain amplifier transistor 510, where a p-type doped extensionregion 526 has been added to the structure. This extension is formed inthe path of the transistor current flow, but may alternatively be placedaway from the transistor channel current flow in a directionperpendicular to the drawing page. In yet another suitable arrangement,a completely independent capacitance varying structure may be formed andconnected to the drain terminal of gain transistor 510 and thecorresponding gate terminal by suitable wiring.

Drain extension region 526 may provide a variable voltage dependentfeedback capacitance (Varicap) that changes the amplifier gain dependingon the number of electrons transferred from the photodiode 512 ontofloating diffusion node 525. Due to the application of the pre-chargepulse to floating diffusion node 525 through pre-charge capacitor 516,the p-channel MOSFET gain transistor output voltage may be changed to alower level. This action increases the voltage difference between thegain transistor gate 510 and its drain terminal 508, thus hillydepleting the p-type doped extension 526. When extension 526 is fullydepleted of holes, the gate to drain capacitance (the feedbackcapacitance Cf) is low and the amplifier gain is therefore high. When alarger amount of charge is transferred onto floating diffusion node 525,the gain transistor drain voltage increases and drain extension 526begins to be again populated by holes. This increases the magnitude offeedback capacitance Cf and consequently reduces the amplifier gain(e.g., the gain associated with transistor 202 of FIG. 2). It is thuspossible, by selecting the correct doping level, the suitable dopingprofile, and the size for the drain extension 526, to control the pixelcharge to voltage transfer characteristic such that a nonlinear transferfunction can be designed for the output voltage.

An example of such a nonlinear piece-wise transfer functioncharacteristic is shown in graph 700 of FIG. 7. In the example of FIG.7, the doping level for the extension 526 is selected such that when2000 electrons have been transferred onto floating diffusion 525, thecharge to voltage conversion characteristic changes from 400 uV/e to 120uV/e. This effect increases the pixel dynamic range. It is now possibleto detect 12,000 electrons instead of only 5000 electrons for a givenpixel output voltage swing if the conversion factor of 400 uV/e is keptunchanged. The high value of the charge to voltage conversion factor isdesirable for the detection of low light level signals. This conceptthus maintains high sensitivity for tow level signals and, at the sametime, accommodates high level signals. This feature thus extends thedynamic range of the image sensor.

For the sake of completeness of the pixel variable gain description, asimplified potential profile diagram 600 of the p-channel MOSFET gaintransistor 202/410/510 along the channel region 602 is shown in FIG. 6.For low level signals, the drain Quasi Fermi level of is at level 603with the extension 526 fully depleted. For high level signals, forlarger number of electrons transferred from the photodiode, the QuasiFermi level moves to the position 604 and the drain extension becomesagain un-depleted. This increases the gate to drain capacitance Cf,thereby changing the in-pixel amplifier gain. The source of thep-channel MOSFET transistor is kept at a constant Vdd level 601.

An example of various bias potentials and a corresponding energy banddiagram within the fully depleted mini n-well under the drain of thep-channel MOSFET gain transistor 202/410/510 is shown in FIG. 8. Asshown in FIG. 8, diagram 800 represents various bias potentials and thepotential barrier for holes in the mini n-well region 405/505. Thesimplified energy band diagram under the transistor drain is representedby the curves 801. The transistor source and the drain junction depthsare indicated as Xj 802. The n-type doped implant in the mini n-wellregion is used to form only a potential barrier for holes 803, therebyforcing holes to flow from the source along the transistor channel(perpendicular to the drawing plane of the figure) to drain. Thesufficiently high barrier thus prevents shorting of the transistor drainand source to ground (the RPW region). The voltage level appearing onthe transistor drain when a current bias is applied to it is shown as aQuasi Fermi level potential for holes Vd 804. The reference bias for themini n-well is indicated by the Quasi Fermi level potential forelectrons Vdd 805. The mini n-well depth is indicated as the region Xmn806. It is thus clear that incorporation of the fully depleted minin-well does not present any problem for the pixel, it does not occupyany additional valuable pixel area, and does not cause any problems suchas injection of electrons or generation of additional dark current thatwould add to the photodiode dark current and thus degrade the overallimage sensor performance. The mini n-well may also be only partiallydepleted of mobile electron charge (not shown in the example of FIG. 8).

In another suitable arrangement, the n-channel MOSFET reset transistor206 can be replaced by a p-channel MOSFET transistor. In this scenario,the polarity of the reset gate pulses must be inverted. The advantagehere is that the mini n-well can now be common to all the circuittransistors in the pixel except for the transfer gate transistors. Thismay have an advantage for some transistor design rule relaxation.

For the sake of completeness, an example of a 4-way shared pixelphotodiode topology is shown in FIG. 9 (e.g., an arrangement in whichfour photodiodes share the same pixel circuitry). As shown in FIG. 9,drawing 900 represents a simplified pixel top view (not to scale). Theactive photodiode regions are shown by regions 901 and may includeanti-dome (AD) implants and RPW compensating opening regions 910 locatedapproximately in the center of the pixel photodiodes. Photodiode region901 may be isolated from similar regions of the neighboring pixels byshallow trench isolation (STI) regions 899. This example is merelyillustrative and, if desired, other types of pixel isolation, such assuitable implants or deep trench isolation (DTI) may be formed betweenthe active pixel portions.

Charge transfer gates are shown by regions 902 that interface with then+ type doped floating diffusion regions 911 connected together by ametal wiring bus. The transfer gates may have regions 912 implantedunderneath, which form charge wells that improve the charge transferefficiency. The n-channel MOSFET reset transistor, the p-channel MOSFETgain transistor, and the p-channel MOSFET addressing transistor areplaced in the STI isolated trunk region 903 located between thephotodiode rows. The p+ type doped p-channel MOSFET gain transistorsource terminal and drain terminal are shown by regions 907 and 908respectively. The transistor source terminal is connected to theadjacent n+ type doped region 916 that provides the bias contact for themini n-well region delineated by the implant mask opening 913.

The p-channel MOSFET gain transistor gate is shown by region 905. Thepixel addressing transistor gate is shown by region 914 and the p+ typedoped drain of this transistor is shown by region 915, where the outputsignal is sensed. The source of this transistor is shared (common) withthe drain of the p-channel MOSFET gain transistor 908. Similarly, then-channel MOSFET reset transistor has its n+ type doped source region906, but its drain region is connected to the floating diffusion regions911. The n-channel MOSFET reset transistor gate is shown by region 904.The pixel wiring details have been omitted for the sake of simplicity.However, contact via 909 placements are indicated by the dark circles.The mask for forming the fully depleted or only the partially depletedmini n-well is indicated by the region bounded by the dashed line 913. Aprimary advantage of the 4-way shared PD layout shown in FIG. 9 is theless stringent requirement for the transistor design rules and a largerphotodiode area, thereby resulting in a larger charge storage capacityin the pixel.

Having thus described the preferred embodiments of the novel imagesensor array that has submicron size pixels with built-in amplificationcircuitry, where the gain of the built-in amplification circuitry iscontrolled by negative voltage feedback, which may vary in dependence onthe number of sensed electrons transferred from the photodiode, thedescribed details in this disclosure are thus intended to beillustrative and not limiting. It is noted that persons skilled in theart can make modifications and variations in light of the aboveteachings. It is therefore to be understood that changes may be made inthe particular embodiments of the invention disclosed, which are withinthe scope and spirit of the invention as defined by the appended claims.

FIG. 10 shows in simplified form a typical processor system 10, such asa digital camera, which includes an imaging device such as imagingdevice 1001 (e.g., imaging device 1001 such as an image sensor thatincludes the backside illuminated global shutter pixels with anintra-pixel amplifying transistor and feedback capacitor as describedabove in connection with FIGS. 1-9). Processor system 1000 is exemplaryof a system having digital circuits that could include imaging device1001. Without being limiting, such a system could include a computersystem, still or video camera system, scanner, machine vision, vehiclenavigation, video phone, surveillance system, auto focus system, startracker system, motion detection system, image stabilization system, andother systems employing an imaging device.

Processor system 1000, which may be a digital still or video camerasystem, may include a lens such as lens 1096 for focusing an image ontoa pixel array when shutter release button 1097 is pressed. Processorsystem 1000 may include a central processing unit such as centralprocessing unit (CPU) 1095. CPU 1095 may be a microprocessor thatcontrols camera functions and one or more image flow functions andcommunicates with one or more input/output (I/O) devices 1091 over a bussuch as bus 1093. Imaging device 1001 may also communicate with CPU 1095over bus 1093. System 1000 may include random access memory (RAM) 1092and removable memory 1094. Removable memory 1094 may include flashmemory that communicates with CPU 1095 over bus 1093. Imaging device1001 may be combined with CPU 1095, with or without memory storage, on asingle integrated circuit or on a different chip. Although bus 1093 isillustrated as a single bus, it may be one or more buses or bridges orother communication paths used to interconnect the system components.

Various embodiments have been described illustrating an imaging system(e.g., image sensor pixel array) having a built-in amplifying circuitand a negative voltage feedback capacitor that allow for increasedphotodiode capacity and dynamic range relative to conventional imagingsystems. The array may include a number of image sensor pixels arrangedin rows and columns.

The image sensor pixels may each include a photodiode that generatescharge in response to image light, a floating diffusion node, and acharge transfer transistor configured to transfer the generated chargefrom the photodiode to the floating diffusion node. An amplifyingtransistor (sometimes referred to herein as a gain transistor) may havea gate terminal coupled to the floating diffusion node, a drain terminalcoupled to a pixel output node, and a source terminal coupled to a biasvoltage column line. A feedback capacitor may be coupled between thepixel output node and the floating diffusion node and may be configuredto provide negative voltage feedback for the floating diffusion node.The amplifying transistor may be configured to provide the transferredcharge with greater than unity again (e.g., a gain greater than one suchthat signals at the floating diffusion node have a lesser magnitude thansignals at the pixel output node).

The pixels may include a reset transistor coupled between the pixeloutput node and the floating diffusion node in parallel with thefeedback capacitor that is configured to reset the floating diffusionnode to a reset voltage and/or to drain overflow charge from thefloating diffusion node. The pixel output node may be coupled to acolumn readout line through a pixel addressing (row select) transistor.A column biasing current source may be coupled to the pixel through thecolumn readout line. A pre-charge capacitor may be coupled between thefloating diffusion node and as pre-charge bus line. If desired, thereset transistor may include an n-channel reset transistor whereas theamplifying transistor and the addressing transistor may each include acorresponding p-channel amplifying transistor. For example, the resettransistor may include a p-channel MOSFET whereas the amplifyingtransistor and the addressing transistor may include correspondingn-channel MOSFETs. In another suitable arrangement, the reset transistormay include a p-channel MOSFET, whereas the amplifying transistor andthe addressing transistor include respective n-channel MOSFETs.

The pixel substrate may include a p-type doped epitaxial layer and ann-type doped well region within which the p-channel amplifyingtransistor and addressing transistor are formed (or a p-type doped wellregion within which the n-channel amplifying transistor and addressingtransistor are formed). A p+ type retrograde doped electron blockinglayer in the semiconductor substrate may separate the n-type doped wellregion from the p-type doped epitaxial layer (or an n+ type retrogradedoped electron blocking layer may separate the p-type doped well regionfrom an n-type doped epitaxial layer).

If desired, the feedback capacitor may have a variable capacitance thatdepends on a potential difference between the gate terminal of theamplifying transistor and the drain terminal of the amplifyingtransistor. The pixel may be formed in a system that also includes acentral processing unit, memory, input-output circuitry, and a lens.

The foregoing is merely illustrative of the principles of this inventionand various modifications can be made by those skilled in the artwithout departing from the scope and spirit of the invention. Theforegoing embodiments may be implemented individually or in anycombination.

What is claimed is:
 1. An image sensor pixel, comprising: a photodiodethat generates charge in response to image light; a floating diffusionnode; a charge transfer transistor configured to transfer the generatedcharge from the photodiode to the floating diffusion node; an amplifyingtransistor having a gate terminal coupled to the floating diffusion nodeand a drain terminal coupled to a pixel output node; and a feedbackcapacitor coupled between the pixel output node and the floatingdiffusion node, wherein the amplifying transistor is configured toprovide the transferred charge with a greater than unity gain and thefeedback capacitor is configured to provide negative voltage feedback tothe floating diffusion node.
 2. The image sensor pixel defined in claim1, further comprising: a reset transistor coupled between the pixeloutput node and the floating diffusion node in parallel with thefeedback capacitor, wherein the reset transistor is configured to resetthe floating diffusion node to a reset voltage.
 3. The image sensorpixel defined in claim 2, further comprising: a column readout linecoupled to a column biasing current source; and a pixel addressingtransistor coupled between the pixel output node and the column readoutline.
 4. The image sensor pixel defined in claim 2, further comprising:a pre-charge capacitor coupled between the floating diffusion node and apre-charge bus line.
 5. The image sensor pixel defined in claim 2,wherein the reset transistor comprises an n-channel reset transistor andthe amplifying transistor comprises a p-channel amplifying transistor.6. The image sensor pixel defined in claim 5, wherein the p-channelamplifying transistor has a source terminal coupled to a column biasvoltage line.
 7. The image sensor pixel defined in claim 5, wherein theimage sensor pixel is formed on a semiconductor substrate, furthercomprising: a p-type doped epitaxial layer in the semiconductorsubstrate; an n-type doped well region in the semiconductor substrate,wherein the p-channel amplifying transistor is formed within the n-typedoped well region; and a p+ type retrograde doped electron blockinglayer in the semiconductor substrate that separates the n-type dopedwell region from the p-type doped epitaxial layer.
 8. The image sensorpixel defined in claim 2, wherein the reset transistor comprises ap-channel reset transistor and the amplifying transistor comprises ann-channel amplifying transistor.
 9. The image sensor pixel defined inclaim 1, wherein the amplifying transistor comprises an n-channelamplifying transistor and wherein the image sensor pixel is formed on asemiconductor substrate, the image sensor pixel further comprising: ann-type doped epitaxial layer in the semiconductor substrate; a p-typedoped well region in the semiconductor substrate, wherein the n-channelamplifying transistor is formed within the p-type doped well region; andan n+ type retrograde doped electron blocking layer in the semiconductorsubstrate that separates the p-type doped well region from the n-typedoped epitaxial layer.
 10. The image sensor pixel defined in claim 1,wherein the feedback capacitor has a variable capacitance that dependson a potential difference between the gate terminal of the amplifyingtransistor and the drain terminal of the amplifying transistor.
 11. Theimage sensor pixel defined in claim 1, wherein the image sensor pixel isformed on a semiconductor substrate, further comprising: pixel isolationregions selected from a group consisting of: shallow trench isolationregions and deep trench isolation regions, wherein the pixel isolationregions are configured to isolate the photodiode from other photodiodeson the semiconductor substrate.
 12. The image sensor pixel defined inclaim 1, wherein the image sensor pixel is formed on a semiconductorsubstrate having opposing front and back sides, wherein the photodiodeis configured to generate the charge in response to image light receivedthrough the back side of the semiconductor substrate.
 13. The imagesensor pixel defined in claim 1, wherein the image sensor pixel isformed on a semiconductor substrate, wherein the semiconductor substrateis coupled to an additional semiconductor substrate, wherein a biascurrent source for the image sensor pixel is formed on the additionalsemiconductor substrate, and wherein the pixel output node is coupled tothe bias current source on the additional semiconductor substratethrough a conductive via.
 14. An image sensor pixel formed on asemiconductor substrate, comprising: a photosensitive region; a chargestorage region configured to store charge generated by thephotosensitive region; and a transistor having a gate coupled to thecharge storage region and a drain coupled to a pixel output node,wherein the transistor is configured to provide a gain greater thanunity to signals transferred to the pixel output node.
 15. The imagesensor pixel defined in claim 14, comprising: a negative voltagefeedback capacitor coupled between the pixel output node and the chargestorage region.
 16. The image sensor pixel defined in claim 15, whereinthe negative voltage feedback capacitor has a variable capacitancedependent upon a potential difference between the gate and the drain ofthe transistor.
 17. The image sensor pixel defined in claim 15, furthercomprising: a row select transistor coupled between the pixel outputnode and a column readout line; and a reset transistor coupled betweenpixel output node and the charge storage region.
 18. The image sensorpixel defined in claim 17, wherein the transistor comprises a firstp-channel metal-oxide-semiconductor field-effect transistor (MOSFET),the row select transistor comprises a second p-channel MOSFET, and thereset transistor comprises an n-channel MOSFET.
 19. The image sensordefined in claim 17, wherein the transistor comprises a first a-channelmetal-oxide-semiconductor field-effect transistor (MOSFET), the rowselect transistor comprises a second n-channel MOSFET, and the resettransistor comprises a p-channel MOSFET.
 20. A system, comprising: acentral processing unit; memory: input-output circuitry; and an imagingdevice, wherein the imaging device comprises: a pixel array having atleast one pixel circuit, and a lens that focuses an image onto the pixelarray, wherein the at least one pixel circuit comprises: a photodiodethat generates charge in response to image light; a floating diffusionregion; a charge transfer transistor configured to transfer thegenerated charge from the photodiode to the floating diffusion node; ap-channel gain transistor having a gate terminal coupled to the floatingdiffusion node and a drain terminal coupled to a pixel output node; afeedback capacitor coupled between the pixel output node and thefloating diffusion region, wherein the p-channel gain transistor isconfigured to provide the transferred charge with a gain that is greaterthan one and the feedback capacitor is configured to provide negativevoltage feedback to the floating diffusion node; and an n-channel resettransistor coupled between the pixel output node and the floatingdiffusion region in parallel with the feedback capacitor.